Hyper 101 comes with two direct contact heat pipes and dual fan design to provide efficient cooling performance. Hyper 101 comes features support for Intelģ Core i3 / Core i5 / Core i7 / Core 2 processors in LGA 1156/775 package.
Hyper TX3 CPU Cooler has universal design and it is ompatible with AMD Socket 754/939/940/AM2/AM3 and Socket LGA 775/1156. With 3 x Direct Contact heat-pipes with aluminum fins Hyper TX3 provides excellent heat dissipation.
Vortex Plus is a low profile CPU cooler with compact size but uncompromising cooling efficiency. The compact feature best suits in HTPC chassis or chassis with slim width and limited space. The heatsink comes with 4 heatpipes and direct contact base to maximize the heat conductivity and dissipation efficiency.
Unmatched performance for the value, these are the tenants that guided Cooler Master engineers when designing the Hyper 212 EVO. Patented Continuous Direct Contact technology ensure that the heat pipes are free of barriers while drawing heat away from the processor. The Hyper 212 EVO is amongst the first CPU Coolers to support the latest processors
Succeeding the popular Hyper 212, the Hyper 212 Plus carries on the legacy of providing a great balance of performance and noise level during high and low speed operations. Hyper 212 Plus is Cooler Master's first cooler to be equipped with an all-in-one mounting solution that includes LGA 1156 and 1366.
Redefining cooling performance for space restricted environments, GeminII M4 is engineered to maximize cooling with its minimal CPU contact gaps and four extremely efficient direct contact heat pipes that provide excellent heat dissipation.
Cooler Master is back to the basics, giving you coolers with optimum airflow, featuring unique asymmetrical dual fan cooling design. Hyper N520 ensures that cool air accelerates straight through the heatsink and exits from the back. Also, it included a 2 to 1 connector for the dual fan.
GeminII S524 features a larger Heat sink for improved cooling performance, and increased memory module clearance to support high end memory modules featuring large Heat sinks of their own. It comes equipped with a modular 120mm fan with an ideal noise performance ratio throughout its supported range of rpm.
TPC 612 is the next generation of CPU cooler thanks to new vertical vapor chamber technology combined with four 6mm heat pipes. A nickel plated, pure polished copper base spreads heat into a tall, aluminum alloy heat sink ensuring optimal cooling. TPC 612 has a slimmer heatsink than the TPC 812 to support overclocking memory modules.
The first ever CPU heatsink to utilize vertical vapor chamber cooling and combine it with heat pipe technology, TPC 812 is prepared to handle the massive heat generated by overclocking and benchmarking. Vertical vapor chamber working in tandem with heat pipes and a specialized heatsink and fin design allow the TPC 812 to outperform the competition.
The Cooler Master V8 GTS is the latest addition to Cooler Masters famous V-series of Performance Heatsink featuring a powerful car engine look. The V8 GTS features a high performance horizontal vapor chamber. It spreads heat up to 8x faster than Heatpipes which minimizes CPU hotspots and quickly balances the heat load between all heatpipes.
A special array of heatpipes was used on GX-7 to take full advantage of all 7 6mm heatpipe heat transfer capacity. On GX-7 two heatpipes were soldered on top of three middle heatpipes. Also, the fins in the middle part of the heatsink of GX-7 were designed in a V-shape. This allows the cooling air to reach the heatsink module more evenly.