High Thermal Conductivity - The thermal compound contains diamond powder, which would provide a thermal conductivity of 4.5 W/m-k that could fulfill the user’s primary needs.
Easy to Apply - Thermaltake’s specially formulated thermal compound fits perfectly with the honeycomb stencil, which provides an easier way to apply your thermal compound for a neat and well-covered surface
that fits all CPUs.
All-In-One Application Kit - This thermal compound application kit includes a set of easily-applied tools for immediate use.
Sustainability and Safety - The high-quality thermal compound provides a longer lifespan of eliminating dry-out or cracking while in use. Non-electrical conductive compound ensures better safety measures for you and
your system.
P/N
CL-O023-GROSGM-A
THERMAL CONDUCTIVITY
4.5 W/m-k
COLOR
Gray
WEIGHT
4g
VISCOSITY
76 Pa-s
THERMAL IMPEDANCE
0.185°C -in²/W
DENSITY
2.55 g/cm³
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