Antec’s Formula 7 thermal compound protects your CPU even when your rig is running on all cylinders. Since little of the CPU’s surface actually touches the heat sink, you need a solution that isolates and facilitates the transfer of heat.
Turbo MX-2 is a high conductive and low resistance compound for components that require the best thermal dissipation. MX-2 is ideally suited for use in CPU, GPU cooling and other applications between power semiconductor components and heat sinks where high thermal conductivity is critical.
Arctic MX-4 is a new thermal compound that guarantees exceptional heat dissipation from components and maintains the needed stability to push your computer system to its maximum.
The high-density, ceramic-based thermal compound specifically designed for modern high-power CPUs and high-performance heatsinks or water-cooling solutions. The Evolution of Cool!
Introducing Arctic Alumina Thermal Compound The first ceramic-based, polysynthetic thermal compound for use between modern high-power CPUs and high performance heatsinks or water-cooling solutions.
Introducing Arctic Silver 5 With its unique high-density filling of micronized silver and enhanced thermally conductive ceramic particles, Arctic Silver 5 provides a new level of performance and stability. Now available at Arctic Silver dealers worldwide, Arctic Silver 5 is definitely The New Reference.
ThermalFusion 400 is a supreme thermal compound that includes high thermal conductivity with low thermal resistance. Its non-curing and non-electrical conductive traits can avoid any short circuit incidence. ThermalFusion 400 is the ultimate solution for thermal dissipation to improve CPU, GPU cooling and other bonding applications.
The Coollaboratory Liquid MetalPad ist the first heat conduction pad, which is composed of 100% metal and melts with just less heating (BurnIn-process), then it confects its superior heat transfer. It dissipates the heat fast and efficiently and needn´t hide from the best heat conduction paste.
IC Diamond 7 Carat Thermal Compound maximizes thermal heat transfer between the CPU core and heatsink by taking advantage of diamond's superior thermal conductivity.
When putting down, nothing beats smooth and easy. That is why we created the PK-2 thermal compound. The PK-2 thermal compound is a high performance thermal bonding agent specially designed for easy application. PK-2's core feature is its low viscosity, allowing for one to quickly and easily apply the thinnest coat of thermal compound possible.
Like two hot lovers, a heatsink and the processor want to make full contact. But microscopic imperfections in their craftsmanship create small gap for air. These gaps act as thermal insulators, inhibiting the transfer of thermal energy from your components.
When putting down, nothing beats smooth and easy. That is why we created the PK-2 thermal compound. The PK-2 thermal compound is a high performance thermal bonding agent specially designed for easy application. PK-2's core feature is its low viscosity, allowing for one to quickly and easily apply the thinnest coat of thermal compound possible.
When putting down, nothing beats smooth and easy. That is why we created the PK-2 thermal compound. The PK-2 thermal compound is a high performance thermal bonding agent specially designed for easy application. PK-2's core feature is its low viscosity, allowing for one to quickly and easily apply the thinnest coat of thermal compound possible.
Like two hot lovers, a heatsink and the processor want to make full contact. But microscopic imperfections in their craftsmanship create small gap for air. These gaps act as thermal insulators, inhibiting the transfer of thermal energy from your components.
The Zalman Extreme Performance Super Thermal Grease is an extreme performance thermal grease with the highest level of heat transfer. It features a syringe applicator that provides convenience during storage and application on a variety of computer components such as the CPU, GPU, and Northbridge chipset.
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