| Essentials | |
|---|---|
| Capacity | 1200 GB |
| Status | Launched |
| Launch Date | Q3'16 |
| Lithography Type | 3D NAND G1 MLC |
| Performance | |
| Sequential Read (up to) | 1700 MB/s |
| Sequential Write (up to) | 1300 MB/s |
| Random Read (100% Span) | 320000 IOPS |
| Random Write (100% Span) | 26000 IOPS |
| Latency - Read | 20 µs |
| Latency - Write | 20 µs |
| Power - Active | Avg. 11W (Write), 9W (Read) |
| Power - Idle | 4W |
| Reliability | |
| Vibration - Operating | 2.17 GRMS |
| Vibration - Non-Operating | 3.13 GRMS |
| Shock (Operating and Non-Operating) | 1000 G/0.5msec |
| Operating Temperature Range | 0°C to 55°C |
| Endurance Rating (Lifetime Writes) | 1480 TBW |
| Mean Time Between Failures (MTBF) | 2 million hours |
| Uncorrectable Bit Error Rate (UBER) | 1 sector per 10^17 bits read |
| Warranty Period | 5 yrs |
| Package Specifications | |
| Weight | Up to 190gm |
| Form Factor | HHHL (CEM2.0) |
| Interface | PCIe NVMe 3.0 x4 |
| Advanced Technologies | |
| Enhanced Power Loss Data Protection | Yes |
| Hardware Encryption | AES 256 bit |
| High Endurance Technology (HET) | No |
| Temperature Monitoring and Logging | Yes |
| End-to-End Data Protection | Yes |