|
Essentials |
| Status |
End of Life |
| Launch Date |
Q3'11 |
| Sequential Read |
270 MB/s |
| Sequential Write |
210 MB/s |
| Random Read (100% Span) |
38500 IOPS |
| Random Write (100% Span) |
2000 IOPS |
| Latency - Read |
75 µs |
| Latency - Write |
85 µs |
| Power - Active |
3.7 W (64K Sequential Write) |
| Power - Idle |
700 mW (Non-DIPM) |
| Vibration - Operating |
2.17 GRMS (5-700 Hz) |
| Vibration - Non-Operating |
3.13 GRMS (5-800 Hz) |
| Shock (Operating and Non-Operating) |
1,500 G/.5 msec |
| Operating Temperature Range |
0°C to 70°C |
| Weight |
up to 80 ± 2 grams |
| Mean Time Between Failures (MTBF) |
2,000,000 Hours |
| Uncorrectable Bit Error Rate (UBER) |
1 sector per 1016 |
| Recommended Customer Price |
N/A |
|
Package Specifications |
| Components |
Intel NAND Flash Memory Multi-Level Cell (MLC) Technology |
| Capacity |
300 GB |
| Form Factor |
2.5" 7mm |
| Interface |
SATA 3.0 3Gb/S |
| Lithography Type |
25 nm |
|
Advanced Technologies |
| Enhanced Power Loss Data Protection |
Yes |
| Hardware Encryption |
AES 128 bit |
| ?High Endurance Technology (HET) |
Yes |
| Temperature Monitoring and Logging |
Yes |
| End-to-End Data Protection |
No |