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B12 Socket LGA 3647 Square ILM, 64mm Height, 205W TDP, Copper/Aluminum CPU Heatsink

Quantity:
  • SKU: 12168030
  • Manufacturer: DYNATRON
  • MPN: B12
  • Availability: USUALLY SHIPS WITHIN 3-5 DAYS
Starting At
$32.84
Quantity:
B12 Socket LGA 3647 Square ILM, 64mm Height, 205W TDP, Copper/Aluminum CPU Heatsink
Recommend for Intel® Xeon ® Platinum /Gold/Silver/Bronze Family Processor (formerly Cascade Lake, Skylake), Socket FCLGA 3647 Square ILM, Aluminum Stacked Fin Soldered on Copper Base with 4x Heat Pipes Embedded for 2U server & up solution, Support CPU Power Up to 205 Watts Heat Dissipation.
CPU Support

Intel

CPU Socket

FCLGA 3647 Square ILM

Solution

2U Server and Up

Dimensions

90 x 90 x 64 mm

Weight

590 g

Material

Aluminum Heatsink, Copper Base with Heatpipes Embedded

Thermal Grease

Shin-Etsu 7762 Pre-Applied

*All product specifications and product images are subject to change without notice.