B12 Socket LGA 3647 Square ILM, 64mm Height, 205W TDP, Copper/Aluminum CPU Heatsink
Quantity:
- SKU: 12168030
- Manufacturer: DYNATRON
- MPN: B12
- Availability: USUALLY SHIPS WITHIN 3-5 DAYS
Starting At
$27.71
B12 Socket LGA 3647 Square ILM, 64mm Height, 205W TDP, Copper/Aluminum CPU Heatsink
Recommend for Intel® Xeon ® Platinum /Gold/Silver/Bronze Family Processor (formerly Cascade Lake, Skylake), Socket FCLGA 3647 Square ILM, Aluminum Stacked Fin Soldered on Copper Base with 4x Heat Pipes Embedded for 2U server & up solution, Support CPU Power Up to 205 Watts Heat Dissipation.
Recommend for Intel® Xeon ® Platinum /Gold/Silver/Bronze Family Processor (formerly Cascade Lake, Skylake), Socket FCLGA 3647 Square ILM, Aluminum Stacked Fin Soldered on Copper Base with 4x Heat Pipes Embedded for 2U server & up solution, Support CPU Power Up to 205 Watts Heat Dissipation.
| CPU Support |
Intel |
|---|---|
| CPU Socket |
FCLGA 3647 Square ILM |
| Solution |
2U Server and Up |
| Dimensions |
90 x 90 x 64 mm |
| Weight |
590 g |
| Material |
Aluminum Heatsink, Copper Base with Heatpipes Embedded |
| Thermal Grease |
Shin-Etsu 7762 Pre-Applied |
*All product specifications and product images are subject to change without notice.