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B9, Socket LGA 3647 Square ILM, 28mm Height, 205W TDP, Copper CPU Cooler

Quantity:
  • SKU: 12168008
  • Manufacturer: DYNATRON
  • MPN: B9
  • Availability: USUALLY SHIPS WITHIN 1-3 WEEKS
Starting At
$41.97
Quantity:
B9, Socket LGA 3647 Square ILM, 28mm Height, 205W TDP, Copper CPU Cooler

Recommend for Intel® Xeon® Platinum / Gold Family Processor( Products formerly Skylake ), Socket FCLGA3647 Square ILM Only, Copper1100 Heatsink with Vapor Chamber Base Active Cooler for 1U Server and up, Ø90 x 15 mm 9015 Aluminum Frame PWM Blower for Heat Exhausting, Support CPU power up to 205 Watts heat dissipation.

CPU Support Intel® Xeon® Platinum / Gold Family Processor
( Products formerly Skylake )
CPU Socket FCLGA3647 Square ILM
Solution 1U Server and Up
Dimensions 93 x 90.5 x 28 mm
Weight 470 g
Material Copper1100 Heatsink with Vapor Chamber Base
Fan Dimension Ø90 x 15 mm
Speed At Duty Cycle 20%: 1000 ± 200 RPM
At Duty Cycle 50%: 2500 ± 10% RPM
At Duty Cycle 100%: 5000 ± 10% RPM
Rated Voltage 12V
Bearing Ball Type, Double
Power At Duty Cycle 20%: 1.2 W
At Duty Cycle 50%: 2.6 W
At Duty Cycle 100%: 12 W
Air Flow At Duty Cycle 20%: 6.8 CFM
At Duty Cycle 50%: 11.0 CFM
At Duty Cycle 100%: 19.0 CFM
Noise Level At Duty Cycle 20%: 16 dBA
At Duty Cycle 50%: 31.5 dBA
At Duty Cycle 100%: 46.4 dBA
Air Pressure At Duty Cycle 20%: 2.8 mm-H2O
At Duty Cycle 50%: 18 mm-H2O
At Duty Cycle 100%: 46 mm-H2O
Lead Wire Pin Out Lead Wire Pin Out
Pin1- (-)
Pin2- (+)
Pin3- (Techometer/Signal output)
Pin4- (PWM)
Thermal Grease Shin-Etsu 7762 Pre-printed