B9, Socket LGA 3647 Square ILM, 28mm Height, 205W TDP, Copper CPU Cooler
Recommend for Intel® Xeon® Platinum / Gold Family Processor( Products formerly Skylake ), Socket FCLGA3647 Square ILM Only, Copper1100 Heatsink with Vapor Chamber Base Active Cooler for 1U Server and up, Ø90 x 15 mm 9015 Aluminum Frame PWM Blower for Heat Exhausting, Support CPU power up to 205 Watts heat dissipation.
CPU Support | Intel® Xeon® Platinum / Gold Family Processor
( Products formerly Skylake ) |
---|---|
CPU Socket | FCLGA3647 Square ILM |
Solution | 1U Server and Up |
Dimensions | 93 x 90.5 x 28 mm |
Weight | 470 g |
Material | Copper1100 Heatsink with Vapor Chamber Base |
Fan Dimension | Ø90 x 15 mm |
Speed | At Duty Cycle 20%: 1000 ± 200 RPM
At Duty Cycle 50%: 2500 ± 10% RPM At Duty Cycle 100%: 5000 ± 10% RPM |
Rated Voltage | 12V |
Bearing | Ball Type, Double |
Power | At Duty Cycle 20%: 1.2 W
At Duty Cycle 50%: 2.6 W At Duty Cycle 100%: 12 W |
Air Flow | At Duty Cycle 20%: 6.8 CFM
At Duty Cycle 50%: 11.0 CFM At Duty Cycle 100%: 19.0 CFM |
Noise Level | At Duty Cycle 20%: 16 dBA
At Duty Cycle 50%: 31.5 dBA At Duty Cycle 100%: 46.4 dBA |
Air Pressure | At Duty Cycle 20%: 2.8 mm-H2O
At Duty Cycle 50%: 18 mm-H2O At Duty Cycle 100%: 46 mm-H2O |
Lead Wire Pin Out | Lead Wire Pin Out
Pin1- (-) Pin2- (+) Pin3- (Techometer/Signal output) Pin4- (PWM) |
Thermal Grease | Shin-Etsu 7762 Pre-printed |