B9, Socket LGA 3647 Square ILM, 28mm Height, 205W TDP, Copper CPU Cooler
- SKU: 12168008
- Manufacturer: DYNATRON
- MPN: B9
- Availability: USUALLY SHIPS WITHIN 1-3 WEEKS
Price
$48.32
B9, Socket LGA 3647 Square ILM, 28mm Height, 205W TDP, Copper CPU Cooler
Recommend for Intel® Xeon® Platinum / Gold Family Processor( Products formerly Skylake ), Socket FCLGA3647 Square ILM Only, Copper1100 Heatsink with Vapor Chamber Base Active Cooler for 1U Server and up, Ø90 x 15 mm 9015 Aluminum Frame PWM Blower for Heat Exhausting, Support CPU power up to 205 Watts heat dissipation.
| CPU Support | Intel® Xeon® Platinum / Gold Family Processor
( Products formerly Skylake ) |
|---|---|
| CPU Socket | FCLGA3647 Square ILM |
| Solution | 1U Server and Up |
| Dimensions | 93 x 90.5 x 28 mm |
| Weight | 470 g |
| Material | Copper1100 Heatsink with Vapor Chamber Base |
| Fan Dimension | Ø90 x 15 mm |
| Speed | At Duty Cycle 20%: 1000 ± 200 RPM
At Duty Cycle 50%: 2500 ± 10% RPM At Duty Cycle 100%: 5000 ± 10% RPM |
| Rated Voltage | 12V |
| Bearing | Ball Type, Double |
| Power | At Duty Cycle 20%: 1.2 W
At Duty Cycle 50%: 2.6 W At Duty Cycle 100%: 12 W |
| Air Flow | At Duty Cycle 20%: 6.8 CFM
At Duty Cycle 50%: 11.0 CFM At Duty Cycle 100%: 19.0 CFM |
| Noise Level | At Duty Cycle 20%: 16 dBA
At Duty Cycle 50%: 31.5 dBA At Duty Cycle 100%: 46.4 dBA |
| Air Pressure | At Duty Cycle 20%: 2.8 mm-H2O
At Duty Cycle 50%: 18 mm-H2O At Duty Cycle 100%: 46 mm-H2O |
| Lead Wire Pin Out | Lead Wire Pin Out
Pin1- (-) Pin2- (+) Pin3- (Techometer/Signal output) Pin4- (PWM) |
| Thermal Grease | Shin-Etsu 7762 Pre-printed |