K618, Socket LGA 115X/1200, 66mm Height, 125W TDP, Copper/Aluminum CPU Heatsink
Recommend for Intel® Socket LGA 1150, LGA 1151, LGA 1155, LGA 1156, and LGA 1200, Passive Copper base with Heatpipes Heatsink, Support 125 Watts CPU Power Heat Dissipation for 2U Server & Up.
Recommend for Intel® Socket LGA 1150, LGA 1151, LGA 1155, LGA 1156, and LGA 1200, Passive Copper base with Heatpipes Heatsink, Support 125 Watts CPU Power Heat Dissipation for 2U Server & Up.
CPU Support |
Intel |
---|---|
CPU Socket |
LGA115X/1200 |
Solution |
2U Server and Up |
Dimensions |
90.0 x 90.0 x 66.0 mm |
Weight |
490 g |
Material |
Aluminum Stacked Fin |
Thermal Grease |
Pre-Applied Shin-Etsu Thermal Grease |