S2, Socket LGA 4677, 64mm Height, 300W TDP, Copper/Aluminum CPU Heatsink
Quantity:
- SKU: 14795285
- Manufacturer: DYNATRON
- MPN: S2
- Availability: USUALLY SHIPS WITHIN 1-3 WEEKS
Starting At
$40.54
S2, Socket LGA 4677, 64mm Height, 300W TDP, Copper/Aluminum CPU Heatsink
S2 - Recommend for Intel® Sapphire Rapids Processor, Socket FCLGA 4677, Aluminum Fin Stack, 5 Heatpipes with Vapor Chamber Base, Passive Cooler for 2U Server and up, Support 350W CPU powered heat dissipation.
S2 - Recommend for Intel® Sapphire Rapids Processor, Socket FCLGA 4677, Aluminum Fin Stack, 5 Heatpipes with Vapor Chamber Base, Passive Cooler for 2U Server and up, Support 350W CPU powered heat dissipation.
| CPU Support | Intel® Sapphire Rapids Processor |
| CPU Socket | Socket FCLGA 4677 |
| Solution | 2U Server and up |
| Dimensions | 118 x 78 x 64 mm |
| Weight | 526.60 g |
| Material | Copper Vapor Chamber and heat pipe, Aluminum Fin Stack |
| Thermal Grease | Pre-Printed with SHIN-ETSU 7762 |
| NOTE: | Dynatron S2, S3, S4, S5 and S6 each comes with E1B Package Carrier. E1A and E1C Package Carriers are not included but they are available upon request. |