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Home › Components › Accessories › Server Accessories › Heatsinks and CPU Coolers
S2, Socket LGA 4677, 64mm Height, 300W TDP, Copper/Aluminum CPU Heatsink
S2, Socket LGA 4677, 64mm Height, 300W TDP, Copper/Aluminum CPU Heatsink
S2, Socket LGA 4677, 64mm Height, 300W TDP, Copper/Aluminum CPU Heatsink
S2, Socket LGA 4677, 64mm Height, 300W TDP, Copper/Aluminum CPU Heatsink

S2, Socket LGA 4677, 64mm Height, 300W TDP, Copper/Aluminum CPU Heatsink

  • SKU: 14795285
  • Manufacturer: DYNATRON
  • MPN: S2
  • Availability: USUALLY SHIPS WITHIN 1-3 WEEKS
Price
$46.52
Quantity:
S2, Socket LGA 4677, 64mm Height, 300W TDP, Copper/Aluminum CPU Heatsink
S2 - Recommend for Intel® Sapphire Rapids Processor, Socket FCLGA 4677, Aluminum Fin Stack, 5 Heatpipes with Vapor Chamber Base, Passive Cooler for 2U Server and up, Support 350W CPU powered heat dissipation.
CPU Support Intel® Sapphire Rapids Processor
CPU Socket Socket FCLGA 4677
Solution 2U Server and up
Dimensions 118 x 78 x 64 mm
Weight 526.60 g
Material Copper Vapor Chamber and heat pipe, Aluminum Fin Stack
Thermal Grease Pre-Printed with SHIN-ETSU 7762
NOTE: Dynatron S2, S3, S4, S5 and S6 each comes with E1B Package Carrier. E1A and E1C Package Carriers are not included but they are available upon request.