Capacity | 2 TB |
Interface M.2 2280 3 | PCIe® Gen3 8 Gb/s, up to 4 Lanes |
NAND Type | TLC |
Performance 1 | |
Sequential Read (MB/s) up to (Queues = 32, Threads = 1) |
3,500 |
Sequential Write (MB/s) up to (Queues = 32, Threads = 1) |
3,500 |
Random Read 4KB IOPS up to (Queues=32, Threads=16) |
600K |
Random Write 4KB IOPS up to (Queues=32, Threads=16) |
600K |
Endurance (TBW) 6 | 900 |
Power | |
Average Active Power 7 | 90mW |
Low Power (PS3) | 30mW |
Sleep (PS4) (low power) | 5mW |
Maximum Operating Power 8 | 4.5W |
Reliability | |
MTTF (hours) 9 | 1.5M |
Environmental | |
Operating Temperatures 10 | 32°F to 158°F (0°C to 70°C) |
Non-operating Temperatures 11 | -40°F to 185°F (-40°C to 85°C) |
Operating Vibration | 5.0 gRMS, 10–2000 Hz, 3 axes |
Non-Operating Vibration | 4.9 gRMS, 7–800 Hz, 3 axes |
Shock | 1,500 G @ 0.5 msec half sine |
Certifications |
BSMI, CAN ICES-3(B)/NMB-3(B), CE, FCC, KCC, Morocco, RCM, TUV, UL, VCCI |
Limited Warranty 5 | 5 years |
Physical Dimensions | |
Form Factor | M.2 2280 |
Length | 80 ± 0.15mm |
Width | 22 ± 0.15mm |
Height | 2.38mm |
Weight | 6.5g ± 1g |
Ordering Information | |
Model Number | WDS200T3B0C |
Footnotes: Specifications subject to change without notice
1 Test Conditions: Performance is based on the CrystalDiskMark™ 8.0.1 benchmark, 1000MB LBA range, on an Asus™ ROG Crosshair VIII Hero X570 desktop with AMD® Ryzen 9 3950X 16-Core, 32GB 3200MHz DDR4,
Windows® 10 Pro |